Impact of the Packaging on the Static Behavior of Piezoresitive Pressure Sensor Dedicated to the Monitoring of Blast Waves
Résumé
The packaging is an important step, allowing to transform the transducer chip into a sensor. This step is necessary to perform the sensor characterization in a real environment, while minimizing the impact of the influence parameters on the sensor response. This study concerns the impact of the packaging on the static response of a miniature pressure sensor dedicated to the monitoring of blast waves. The transducer is based on 5 µm-thick rectangular (55 µm x 135 µm) silicon membrane and piezoresistive gauges. Pressure sensitivity measurements are performed using stressed and non-stressed sensor's holder configurations. Measurements results indicate that the pressure sensitivity is doubled when the sensor's holder is stressed. Finite Element Method simulations using COMSOL Multiphysics software show here that this result originates from the deformation of the sensor's holder, which leads to the deflection of the thin silicon membrane.
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Sensordevice 2022 - Impact of the Packaging on the Static Behavior of Piezoresitive Pressure Sensor.pdf (742.65 Ko)
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