Passive and chipless packaged sensor for the wireless pressure monitoring in harsh environment

Julien Philippe 1 Cristina Arenas 1 Dominique Henry 1 Anthony Coustou 2 Alexandre Rumeau 2 Hervé Aubert 1 Patrick Pons 1
1 LAAS-MINC - Équipe MIcro et Nanosystèmes pour les Communications sans fil
LAAS - Laboratoire d'analyse et d'architecture des systèmes [Toulouse]
2 LAAS-I2C - Service Instrumentation Conception Caractérisation
LAAS - Laboratoire d'analyse et d'architecture des systèmes [Toulouse]
Abstract : A new millimetre-wave passive and chipless packaged sensor for wireless pressure monitoring in harsh environment is proposed. This sensor uses a planar microstrip resonator coupled with a high resistivity silicon membrane. The remote interrogation of this sensor is performed from a Frequency-Modulated Continuous-Wave (FMCW) radar. Prototypes have been designed and fabricated using photoresist intermediate layer for the silicon membrane bonding. Radar measurements on two sensors validate a 6dB full-scale response for 1.4 bar overpressure. Depression measurements demonstrate the transducer hermeticity and a measured sensitivity of 1.6% per bar on the millimetre-wave resonant frequency.
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Conference papers
Eurosensors, Sep 2017, Paris, France. Eurosensors, 3p., 2017
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Julien Philippe, Cristina Arenas, Dominique Henry, Anthony Coustou, Alexandre Rumeau, et al.. Passive and chipless packaged sensor for the wireless pressure monitoring in harsh environment. Eurosensors, Sep 2017, Paris, France. Eurosensors, 3p., 2017. 〈hal-01570698〉

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