Modeling of the interface formation during CuO deposition on Al(111) substrate: linking material design and elaboration process parameters through multi-levels approach

Mathilde Guiltat 1 Nicolas Salles 1 Marie Brut 1 Georges Landa 1 Nicolas Richard 2 Sébastien Vizzini 3 Anne Hémeryck 1
1 LAAS-M3 - Équipe Modélisation Multi-niveaux des Matériaux
LAAS - Laboratoire d'analyse et d'architecture des systèmes [Toulouse]
2 DAM/DIF - DAM Île-de-France
3 IM2NP - Institut des Matériaux, de Microélectronique et des Nanosciences de Provence
Abstract : In this paper, we use a multi-levels modeling approach to describe the elaboration of directly integrated energetic materials. The deposition of copper oxide on aluminum substrate is described. Atomic scale calculations are first conducted to identify local mechanisms involved during the growth of CuO on Al(111). These atomic scale data are then used to parameterize a macroscopic code, inspired on a kinetic Monte Carlo methodology dedicated to simulate vapor like deposition process. The objective is to establish the link between the microstructure of materials and the way they are achieved, i.e. the process parameters such as temperature and gas pressure. This work is conducted in the context of the integration of nano-structured energetic thermites used as micro energy source in microelectronic devices. We show that the temperature of the deposition process appears as the driving parameter to tailor the thickness of interfacial layers.
Type de document :
Article dans une revue
Modelling and Simulation in Materials Science and Engineering, IOP Publishing, 2017, Focus on MMM 2016, 25 (6), pp.064005. 〈http://iopscience.iop.org/article/10.1088/1361-651X/aa7bbc/meta;jsessionid=8B76486D63ECCDCDFAEE0D5544A95821.c1.iopscience.cld.iop.org〉. 〈10.1088/1361-651X/aa7bbc〉
Liste complète des métadonnées

Littérature citée [36 références]  Voir  Masquer  Télécharger
https://hal.laas.fr/hal-01574744
Contributeur : Anne Hemeryck <>
Soumis le : vendredi 18 août 2017 - 09:54:18
Dernière modification le : vendredi 26 octobre 2018 - 10:36:59

Fichier

MSMSE-HEMERYCK-Author.pdf
Fichiers produits par l'(les) auteur(s)

Identifiants

Collections

LAAS | UNIV-TLN | UNIV-TLSE3 | INSA-TOULOUSE | CEA | IM2NP | UNIV-AMU | DAM

Citation

Mathilde Guiltat, Nicolas Salles, Marie Brut, Georges Landa, Nicolas Richard, et al.. Modeling of the interface formation during CuO deposition on Al(111) substrate: linking material design and elaboration process parameters through multi-levels approach. Modelling and Simulation in Materials Science and Engineering, IOP Publishing, 2017, Focus on MMM 2016, 25 (6), pp.064005. 〈http://iopscience.iop.org/article/10.1088/1361-651X/aa7bbc/meta;jsessionid=8B76486D63ECCDCDFAEE0D5544A95821.c1.iopscience.cld.iop.org〉. 〈10.1088/1361-651X/aa7bbc〉. 〈hal-01574744〉

Exporter

BibTeX TEI DC DCterms EndNote

Partager

Métriques

Consultations de la notice

314

Téléchargements de fichiers

73

Contact

support.ccsd.cnrs.fr
hal.support@ccsd.cnrs.fr
Logo CCSD