Soft mold NanoImprint Lithography: A versatile tool for sub-wavelength grating applications

Sylvain Pelloquin 1 Sylvain Augé 1 Ksenia Sharshavina 1 Jean-Baptiste Doucet 2 Anatole Héliot 1 Henri Camon 1 Olivier Gauthier-Lafaye 1
1 LAAS-PHOTO - Équipe Photonique
LAAS - Laboratoire d'analyse et d'architecture des systèmes [Toulouse]
2 LAAS-TEAM - Service Techniques et Équipements Appliqués à la Microélectronique
LAAS - Laboratoire d'analyse et d'architecture des systèmes [Toulouse]
Abstract : Due to its independency to the substrate used, Soft mold NanoImprint Lithography (S-NIL) is a technique of great interest in particular for the fabrication of optical devices. We demonstrate a mature pathway for the realization of optical filters from the conception to the optical characterization. Those filters can be realized on large surfaces (up to 6" diameter wafers) with high conformity on various substrates. Quality of the transfer will be discussed throughout the process and optical performances compared to those obtained with classical techniques. In this paper we fabricated tunable spectral filters with a grating periodicity down to 260 nm and imprint surfaces up to 6". Physical conformity of the gratings will be discussed in terms of long-range stitching obtained on 6" Si hard mold, dimensional shrinkage during thermal NanoImprint on Zeonor® soft mold and conformity towards patterned hard mold throughout the process.
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Communication dans un congrès
IEEE. 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2017) , May 2017, Bordeaux, France. 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 5p., 2017, 〈http://www.dtip-mems.org/2017/index.html〉. 〈10.1109/DTIP.2017.7984454〉
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Soumis le : jeudi 21 décembre 2017 - 11:03:48
Dernière modification le : mardi 11 septembre 2018 - 15:19:12

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Sylvain Pelloquin, Sylvain Augé, Ksenia Sharshavina, Jean-Baptiste Doucet, Anatole Héliot, et al.. Soft mold NanoImprint Lithography: A versatile tool for sub-wavelength grating applications. IEEE. 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2017) , May 2017, Bordeaux, France. 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 5p., 2017, 〈http://www.dtip-mems.org/2017/index.html〉. 〈10.1109/DTIP.2017.7984454〉. 〈hal-01670171〉

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