;. Dow-chemical-company, . Intervia-bpn, and . Photoresist, , 2008.

D. W. Johnson, J. Goettertb, V. Singhb, and D. Yemaneb, Opportunities for SUEX dry laminate resist in microfluidic MEMS applications, Proceedings HARMST Hsinchu/Taiwan, pp.36-37, 2011.

C. A. Klein, How accurate are Stoney's equation and recent modifications, J Appl Phys, vol.88, p.5487, 2000.
DOI : 10.1063/1.1313776

A. Kohlstedt, M. Schlaak, and F. Helmut, Tiefenlithographieprozess für SU-8-dickschicht-funktionsstrukturen auf FR4-leiterplattenmaterial, Proceedings Technol Werkstoffe Mikrosyst Nanotechnik-2. GMM Workshop, vol.4, p.p, 2010.

B. Li, M. Liu, and Q. Chen, Low stress ultrathick Su 8 UV photolithography process for MEMS, J Microlithogr Microfabr Microsyst, vol.4, p.43008, 2005.
DOI : 10.1117/1.2117108

H. Li, Y. Li, and J. Feng, Fabrication of 340-GHz folded waveguides using KMPR photoresist, IEE Electron Device Lett, vol.34, issue.3, 2013.

Y. M. Shin, D. Gamzina, B. L. Yaghmaie, F. Baig-a-luhmann, and N. C. , UV Lithography and molding fabrication of ultrathick micrometallic structures using a KMPR photoresist, J Microelectromechanical Sys, vol.19, issue.3, 2010.

M. Staab, F. Greiner, M. Schlosser, and H. F. Schlaak, Applications of novel high aspect ratio ultra-thick UV photoresist for micro electroplating, JMEMS, vol.20, issue.1, pp.794-796, 2011.