This paper presents two methods to characterize the thermal coefficient of pressure sensitivity without hydrostatic pressure measurements. These methods are then easier to implement because they only use electrostatic pressure. One model uses the thermal coefficient of capacity and the thermal coefficient of electrostatic pressure sensitivity. The second one is based on the thermal coefficient of capacity and on the thermal coefficient of fundamental resonance frequency. These two models have been validated between-20°C +150°C for circular silicon membrane manufactured with silicon/pyrex technology.