D. Celo, The creation of compact thermal models of electronic components using model reduction, IEEE Transactions on Advanced Packaging, vol.28, pp.240-251, 2005.

E. Monier-vinard, V. Bissuel, C. Dia, and O. Daniel, Delphi style compact modeling by means of genetic algorithms of system in Package devices using composite sub-compact thermal models dedicated to model order reduction, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp.1170-1178, 2012.

H. B. Aissia, J. Jay, S. Xin, and R. Knikker, Thermal Reduced Order Model for an Electronic Power Module, 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), pp.1-4, 2018.
URL : https://hal.archives-ouvertes.fr/hal-02142081

Z. Zhou, P. M. Holland, and P. Igic, Compact thermal model of a three-phase IGBT inverter power module, 26th International Conference on Microelectronics, pp.167-170, 2008.

J. J. Rodriguez, Thermal component models for electro thermal analysis of multichip power modules, Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344), vol.1, pp.234-241, 2002.

M. Shahjalal, H. Lu, and C. Bailey, Electro-thermal modelling of multichip power modules for high power converter application, 2017 18th International Conference on Electronic Packaging Technology (ICEPT), pp.940-945, 2017.

J. Fradin, D. Elzo, S. Sanchez, C. Cadile, M. Balzer et al., Innovative power modules: junction temperature estimation, 12h European ATW on Micropackaging and Thermal Management (IMAPS), 2017.

J. Favre, J. Reynes, J. Fradin, C. Cadile, S. Sanchez et al., Double side cooled Electronic Power Module, pp.1-8, 2017.

W. Habra, P. Tounsi, and J. Dorkel, Advanced compact thermal model using VHDL-AMS, 12th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), pp.225-228, 2006.

W. Habra, P. Tounsi, F. Madrid, P. Dupuy, C. Barbot et al., A New Methodology for Extraction of Dynamic Compact Thermal Models, 13th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), pp.141-144, 2007.
URL : https://hal.archives-ouvertes.fr/hal-00202550