W. Saito, Y. Takada, M. Kuraguchi, and K. , Tsuda et I. Omura, « Recessedgate structure approach toward normally off high-voltage AlGaN/GaN HEMT for power electronics applications, IEEE Trans. On Electron Devices, vol.53, p.2, 2006.

X. Hu, G. Simin, J. Yang, M. A. Khan, R. Gaska et al., Enhancement mode AlGaN/GaN HFET with selectively grown pn junction gate, Electronics Letters, vol.36, issue.8, pp.8-753, 2000.
DOI : 10.1049/el:20000557

G. Greco, F. Iucolano, and F. Roccaforte, Review of technology for normally-off HEMTs with p-GaN gate, Material Science in Semiconductor Processing, pp.96-106, 2018.
DOI : 10.1016/j.mssp.2017.09.027

Y. Uemoto, M. Hikita, H. Ueno, H. Matsuo, H. Ishida et al., Gate Injection Transistor (GIT) ? A normally-off AlGaN/GaN power transistor using conductivity modulation, p.12, 2007.

H. Kambayashi, Y. Satoh, S. Ootomo, T. Kokawa, T. Nomura et al., Over 100A operation normally-off AlGaN/GaN hybrid MOS-HFET on Si substrate with high-breakdown voltage, Solid-State Electronics, vol.54, issue.6, pp.660-664, 2010.
DOI : 10.1016/j.sse.2010.01.001

X. Huang, Z. Liu, G. Li, and F. C. Lee, Evaluation and application of 600V GaN HEMT in cascode structure », APEC 2013, pp.1279-1286, 2013.

S. Hamady, F. Morancho, B. Beydoun, P. Austin, and M. Gavelle, Pdoped region below the AlGaN/GaN interface for normally-off HEMT », EPE'2014

E. Frayssinet, Y. Cordier, H. P. , D. Schenk, and A. Bavard, Growth of thick GaN layers on 4-in. and 6-in. silicon (111) by metal-organic vapor phase epitaxy, physica status solidi (c), vol.8, issue.5, pp.1479-1482, 2011.
DOI : 10.1002/pssc.201000885

Y. Cordier, M. Azize, N. Baron, Z. Bougrioua, S. Chenot et al., Subsurface Fe-doped semi-insulating GaN templates for inhibition of regrowth interface pollution in AlGaN/GaN HEMT structures, Journal of Crystal Growth, vol.310, issue.5, pp.948-954, 2008.
DOI : 10.1016/j.jcrysgro.2007.11.161

URL : https://hal.archives-ouvertes.fr/hal-00357273

F. Torregrosa, Y. Spiegel, J. Duchaine, T. Michel, G. Borvon et al., Recent developments on PULSION?? PIII tool: FinFET 3D doping, high temp implantation, III-V doping, contact and silicide improvement, & 450 mm, 2015 15th International Workshop on Junction Technology (IWJT), p.2015, 2015.
DOI : 10.1109/IWJT.2015.7467061

S. Hamady, F. Morancho, B. Beydoun, P. Austin, and M. Gavelle, « Hybrid normally-off AlGaN/GaN HEMT using GIT technique with a p-region below the channel, p.2014, 2014.