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Temporary adhesives for wafer bonding: deep reactive ion etching application

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https://hal.laas.fr/hal-03167904
Contributor : Emilie Marchand <>
Submitted on : Friday, March 12, 2021 - 3:24:44 PM
Last modification on : Thursday, June 10, 2021 - 3:05:43 AM

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  • HAL Id : hal-03167904, version 1

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David Colin, Djaffar Belharet, Pascal Dubreuil, Laurent Mazenq, Hugues Granier. Temporary adhesives for wafer bonding: deep reactive ion etching application. European Microelectronics and Packaging Conference (EMPC 2009), Jun 2009, Rimini, Italy. ⟨hal-03167904⟩

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