Contribution à l’intégration des circuits micro-ondes et millimétriques pour les télécommunications

Christophe Viallon 1
1 LAAS-MOST - Équipe Microondes et Opto-microondes pour Systèmes de Télécommunications
LAAS - Laboratoire d'analyse et d'architecture des systèmes [Toulouse]
Abstract : The work presented in this document deals with the integration of microwave and millimeter-wave circuits. It follows the global trend towards improved performances, miniaturized, low-power and cost-effective circuits. Our research activity includes both the integration of active circuits as well as passive components. The first given example proposes some solutions aimed for noise performance optimization of integrated RF power amplifiers whose non-linear operation translates the LF noise sources up to microwave frequencies. We then propose to use the passive mixer based on MOS transistors as a possible candidate for future flexible and reconfigurable radio architectures. The optimizations performed at the device level as well as circuit topology significantly push the maximum operating frequencies up to V and W bands through the implementation of sampling and sub-sampling techniques, which also significantly reduce mixer’s conversion losses. Finally, since the beginning of the microelectronic industry, the back-end-of-line is processed essentially in two dimensions, by stacking metal layers. We are developing an original approach that seeks to provide an additional degree of freedom by allowing the metalization of the sidewalls of a pillar of resin. This innovation, which has been patented, enables the fabrication of passive devices in three dimensions (3D), such as solenoids and RF transformers, for a very low cost. The successive improvements achieved in the fabrication process have led to extremely compact devices with performances that are currently at the level of the state of the art.
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Micro et nanotechnologies/Microélectronique. Universite Toulouse III Paul Sabatier, 2016
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  • HAL Id : tel-01393201, version 2

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Christophe Viallon. Contribution à l’intégration des circuits micro-ondes et millimétriques pour les télécommunications. Micro et nanotechnologies/Microélectronique. Universite Toulouse III Paul Sabatier, 2016. 〈tel-01393201v2〉

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