Architectures d'intégration mixte monolithique-hybride de cellules de commutation de puissance sur puces multi-pôles silicium et assemblages optimisés

Abstract : Currently, the standard 2D hybrid power module (power converter) is the reference technology for the medium and high power market. This hybrid power module is a discrete multi-chip case. The semi-conductor chips are interconnected by wire-bonding to form switching cells. The wire-bonding interconnection technology is a limiting factor in terms of electrical and thermomechanical performances, three-dimensional integrability and productivity. The aim of this thesis is to study new architectures of very integrated power converters. Compared to the so-called hybrid reference technology, the proposed architectures aim at a greater degree of integration, with an integration at both the semi-conductor level (monolithic integration) and the packaging level (hybrid integration). Monolithic integration consists in integrating switching cells into new multi-terminal macro-chip architectures. Hybrid integration consists in developing of new technologies to assemble these macro-chips. To validate the different proposed integration architectures, the first step was to study and validate the operating modes of the new chips by SentaurusTM TCAD simulations. Then, the multi-terminal chips were realized in the micro and nanotechnology platform of LAAS-CNRS laboratory. Finally, the chips were bonded on PCB substrates to realize power converter circuit prototypes. The highly integrated switching loop presents a stray inductance loop lower than one nanohenry, wich is an important improvement as compared to the values reported in literature (about 20 nH).
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Adem Lale. Architectures d'intégration mixte monolithique-hybride de cellules de commutation de puissance sur puces multi-pôles silicium et assemblages optimisés. Physique [physics]. Université Paul Sabatier - Toulouse III, 2017. Français. ⟨NNT : 2017TOU30174⟩. ⟨tel-01730586v2⟩

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