One of the challenges of our time is related to the production and management of electrical energy. In this context, the improvement of power semiconductor devices is one of the keys to meet this challenge. Most of current power devices are made of silicon. However, the demands of power electronics applications in terms of voltage withstand, power density, temperature and switching frequency are becoming higher. The intrinsic physical properties of wide-bandgap semiconductors (SiC, GaN, Diamond) make it possible to consider the design and fabrication of power devices that are much more efficient than all-silicon structures. In this context, our work focuses on the development and optimization of technological steps enabling the realization of diamond MOS power devices. They were carried out as part of the ANR project MOVeToDIAM, coordinated by LAAS-CNRS, in the continuity of the work on diamond made in the laboratory since 2005. Diamond is therefore a wide bandgap semiconductor (Eg = 5.5 eV) particularly suitable for high power and high temperature applications. It has high carrier mobilities (2200cm2/Vs for electrons and 2050cm2/Vs for holes), allowing the passage of high current densities, a high breaking field (Ec ~ 10 MV/cm) and a strong thermal conductivity (lambda ~ 20 W.cm-1.K-1) facilitating heat dissipation. However, despite these promising properties, many technological locks are still to be lifted in order to lead to the fabrication of power devices on diamond. We have therefore studied and optimized several critical technological steps to overcome the problems caused by the small sample size (2x2mm2 to 3x3mm2). The photolithography steps were developed and optimized for two types of resin (positive AZ4999 and negative NLOF 203) using a Spray-Coater and a direct laser writing machine, thus greatly improving the minimal resolution, up to 1 µm, of the patterns defined on the samples. In order to characterize ohmic contacts, we have developed two test structures: the Transmission Line Method (TLM) and the Circular TLM (Circular Transmission Line Method). If the realization of ohmic contacts on P-type diamond is mastered, the specific contact resistance must be further improved to limit its impact on the electrical performance of the devices. In addition, according to the literature, no ohmic contact has been made on N-type diamond, because of the difficulty of achieving high levels of doping, which remains a major obstacle to the development of the diamond industry. The fabrication of ohmic contacts on P-type and N-type diamond has been optimized on different samples.[...]