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Stratégie de testabilité en production des cartes électroniques à forte densité d’intégration et à signaux rapides

Nabil El Belghiti Alaoui 1
1 LAAS-ESE - Équipe Énergie et Systèmes Embarqués
LAAS - Laboratoire d'analyse et d'architecture des systèmes
Abstract : Until today, the production tests are based mainly on optical verification (AOI), X-ray inspection (AXI), electrical (ICT) and functional tests. Faced with the miniaturization of component packages, the high densification and integration of several technologies (digital, analog, radio frequency, power ...) on the same PCB (Printed Circuit Board), the test techniques listed above are no longer sufficient to fully meet the production test coverage requirements, because they are costly in terms of development time and test cycle and are not very efficient.The objective of this CIFRE thesis with ACTIA Automotive in collaboration with LAAS-CNRS is to define an innovative production test strategy adapted to high-density products. To do this, we have addressed in this work, improvements to existing test methodologies and proposed test approaches usable upstream of the production process of PCBAs (Printed Circuit Board Assemblies).First, we introduced a new contactless technique for testing PCBAs with limited physical test access. The technique involves the use of near-field magnetic sensors, which detect the magnetic signatures from components mounted on the PCB in order to test their presence and their value thereafter. Secondly, a test approach using infrared thermal signatures is presented. This technique can detect component assembly defects such as, presence, value and in some cases its state of health, which allows concluding on the PCBA state of defect. In order to evaluate the relevance of these two techniques, several fault scenarios were considered and analyzed with an outlier detection algorithm. In several cases, the manufacturing defects are discriminated with significant margins, while taking into account the variability in component specifications.Finally, a technique for regaining test accessibility on high frequency signal transmission tracks is presented. The technique uses small openings in the solder mask directly above the tracks carrying digital signals. The exposed conductors are contacted with a probe with deformable and anisotropic conductive tip. The industrial feasibility of this technique was tested on a prototype that we developed in collaboration with the ACTIA Group subsidiary: ACTIA Engineering Services.
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Submitted on : Monday, March 8, 2021 - 11:22:40 AM
Last modification on : Tuesday, October 19, 2021 - 11:18:10 PM

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Nabil El Belghiti Alaoui. Stratégie de testabilité en production des cartes électroniques à forte densité d’intégration et à signaux rapides. Micro et nanotechnologies/Microélectronique. INSA de Toulouse, 2020. Français. ⟨NNT : 2020ISAT0018⟩. ⟨tel-03185971v2⟩

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