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Embedded 3D-IPD Technology based on Conformal 3D-RDL: Application for Design and Fabrication of Compact, High-Performance Diplexer and Ultra-Wide Band Balun

Abstract : In this paper, an embedded 3D-IPD technology based on conformal 3D-RDL that yields high performance, small-size and low-cost devices is presented. The technology relies on high-Q thin film capacitors and 3D inductors as well as on thru-mold-vias (TMV) and mold compound to form a surface mount 3D-IPD device (SMD). We demonstrate how to form TMVs simultaneously with 3D-inductors using 3D-RDL technology. Hence, no laser drilling nor tall Cu vias electroplating are required.A WLAN diplexer (2.4 & 5GHz) and an UWB balun (1.4 - 3GHz) where synthesized, fabricated and measured to demonstrate electrical performance of this technology. We first report the impact of 3D inductor's Q-factor on electrical performance of these devices and how to use this data to accurately assess real-life performance of inductors. Then, we demonstrate that low-loss (0.3dB and 0.56dB), high attenuation (24dB and 28dB) and high isolation (25dB and 29dB) are achieved for a 0.38mm 2 3D diplexer. Whereas, an insertion loss <; 0.85dB, amplitude unbalance <; 0.5dB and phase unbalance <; 3° are achieved for 2.5 mm 2 UWB balun. Reliability result is also presented here.
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https://hal.laas.fr/hal-03178281
Contributor : Laas Hal-Laas <>
Submitted on : Tuesday, March 23, 2021 - 4:34:49 PM
Last modification on : Thursday, June 10, 2021 - 3:05:51 AM

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Ayad Ghannam, Alessandro Magnani, David Bourrier, Thierry Parra. Embedded 3D-IPD Technology based on Conformal 3D-RDL: Application for Design and Fabrication of Compact, High-Performance Diplexer and Ultra-Wide Band Balun. 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Jun 2020, Orlando, United States. pp.1867-1874, ⟨10.1109/ECTC32862.2020.00292⟩. ⟨hal-03178281⟩

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