Skip to Main content Skip to Navigation

Stratégie de testabilité en production des cartes électroniques à forte densité d'intégration et à signaux rapides

Nabil El Belghiti Alaoui 1
1 LAAS-ESE - Équipe Énergie et Systèmes Embarqués
LAAS - Laboratoire d'analyse et d'architecture des systèmes
Abstract : In production test strategies are currently based on optical inspection (AOI), X-ray inspection (AXI), electrical (ICT) and functional (FT) tests. Due to the multiplication and miniaturization of electrical components, the coexistence of several technologies (digital, analog, radio frequency, power, etc.) on the same Printed Circuit Board (PCB), these test techniques listed above are no longer sufficient to fully meet production test coverage requirements, because they are relatively inefficient and costly in development and test cycle time. The objective of this CIFRE thesis carried out between ACTIA Automotive and LAAS-CNRS is to define an innovative production test strategy adapted to high-density and high-speed products. In order to do so, we have considered almost all existing PCB testing techniques, addressed improvements to existing test methodologies and proposed test approaches that can be used upstream of high-density, high-speed Printed Circuit Board Assemblies (PCBA) production process. First, we introduced a new contactless technique for testing PCBA when physical test access is very limited. The technique consists of using near magnetic field probes, which detect the magnetic field distribution arising from certain components mounted on the PCB to test their presence on the board and their value afterwards. Second, a test approach using infrared thermal signatures is presented. This technique can detect component assembly defects such as its presence, value and in some cases its health state, which allows to conclude on the defect state of the PCBA. To assess the relevance of these two techniques, several defect scenarios were considered and analyzed with outlier detection algorithms. In several cases, manufacturing defects are discriminated with large margins, while considering the variability of component specification. Finally, a technique for regaining test accessibility on high frequency signal transmission tracks is presented. The technique consists in using small micro openings in the solder mask directly above the tracks transmitting digital signals. The exposed conductors are contacted with a deformable, conductive and anisotropic tip probe. The feasibility of this technique was tested on a prototype that we had developed in collaboration with ACTIA Engineering Services, a subsidiary of ACTIA Group.
Complete list of metadata
Contributor : Laas Hal-Laas <>
Submitted on : Monday, March 8, 2021 - 11:22:40 AM
Last modification on : Thursday, June 10, 2021 - 3:06:14 AM


Version validated by the jury (STAR)


  • HAL Id : tel-03185971, version 2


Nabil El Belghiti Alaoui. Stratégie de testabilité en production des cartes électroniques à forte densité d'intégration et à signaux rapides. Micro et nanotechnologies/Microélectronique. Institut National des Sciences Appliquées de Toulouse, 2020. Français. ⟨NNT : 2020ISAT0018⟩. ⟨tel-03185971v2⟩



Record views


Files downloads